Multi-Project Wafer (MPW) and Low-Volume Production (LVP) Services

Multi-Project Wafer (MPW), or Multi-Project Chip and Low Volume Production (LVP) fabrication services are offered by IP Servicing Centre (IPSC) for fabrication of VLSI circuit development (semiconductor). The MPW fabrication service can reduce the cost for chip-design prototyping by aggregating multiple designs onto one mask set. Customers share the overhead costs associated with mask making, wafer fabrication, and assembly. A small quantity of die (e.g. 40) is obtained. MPW shuttles are scheduled regularly for fabrication.

The Low Volume Production service is designed for customers with large quantities of order (e.g. 24 wafers) of fabrication. IPSC offers Low-Volume Production (fabrication) service for selective foundries only. The Low-Volume Production runs can be scheduled to start fabrication at any time.

IP Servicing Centre is offering a wide variety of semiconductor processes from different wafer foundries, such as Chartered, CSMC, DongBu, e-Shuttle, Fujisu, IBM, Silterra, SMIC, and TSMC.


Click here to Download MPW Forms
Click here for MPW Schedules

Click below icons to request for quotation of fabrication services of MPW / Low-Volume Production.











Below is a typical MPW cycle flow:





HKSTP collects different designs from customers and prepares data to the manufacturing foundry for fabrication. Data manipulations and verifications to the design rules for manufacturing should be done. Packaging and testing are optional according to customer's need.


HKSTP Work Flow

A simple work flow diagram shows to step through setting an account, submitting a design and receiving fabricated parts. Please click here to Download MPW Forms.

Registration

Fill HKSTP Registration Form, Non-Disclosure Agreement (NDA) & Foundry CDA Form

 

Open a customer account

After approved by supplier, a customer account will be set

 

Choose a fabrication process and download process technology

Submit "Download vendor documents and design kits" Form for design kit and information

 

Perform design and verification

Fill a "Request for Quotation" Format any time prior to close of run without obligation

 

Submit GDSII database to HKSTP

Fill "Fabrication" Form for instruction uploading database to HKSTP FTP server

 

HKSTP verification

Manufacturability review, DRC

 

Commit to FAB

Full payment must be received before commit to FAB

 

Foundry processing

 

 

Packaging or Testing

 

 

Parts are shipped to address specified on purchase order

 



Customer Enquiry

Tel. No.: (852) 2629 6600
Fax No.: (852) 2607-4101
Email:     
icdesign@hkstp.org  (please click above foundry icon to make enquiry for faster response)